STRAIN ANALYSES OF NONLINEAR CRACK BEHAVIOR AT ELEVATED TEMPERATURE BY FINITE ELEMENT METHOD AND MOIRE TOPOGRAPHICAL METHOD.

T. Aizawa, G. Yagawa, Y. Ando

研究成果: Paper査読

抄録

In this paper, the measurement scheme for strain analyses presented is the Moire topographical method aided by picture processing with the use of computer. The picture processing technique enables analysis of nonlinear behavior of crack growth under elevated temperature from different points of view. Finite element methods are utilized to calculate the creep crack growth with the large-displacement formulation.

本文言語English
出版ステータスPublished - 2017 1月 1
イベントUnknown conference - Berlin, Ger
継続期間: 1979 8月 131979 8月 17

Other

OtherUnknown conference
CityBerlin, Ger
Period79/8/1379/8/17

ASJC Scopus subject areas

  • 工学(全般)

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