Stress relaxation in dual-damascene Cu interconnects to suppress stress-induced voiding

M.Kawano M.Kawano; T.Fukase T.Fukase; Y.Yamamoto Y.Yamamoto; T.Ito T.Ito; S.Yokogawa S.Yokogawa; H.Tsuda H.Tsuda; Y.Kunimune Y.Kunimune; T.Saitoh T.Saitoh; K.Ueno K.Ueno; Kazuyoshi Ueno

Stress relaxation in dual-damascene Cu interconnects to suppress stress-induced voiding

M.Kawano M.Kawano, T.Fukase T.Fukase, Y.Yamamoto Y.Yamamoto, T.Ito T.Ito, S.Yokogawa S.Yokogawa, H.Tsuda H.Tsuda, Y.Kunimune Y.Kunimune, T.Saitoh T.Saitoh, K.Ueno K.Ueno, Kazuyoshi Ueno

機能制御システム専攻

研究成果: Article › 査読

22 被引用数 (Scopus)

本文言語	English
ページ（範囲）	210-212
ジャーナル	Proc. 2003 International Interconnect Technology conference
出版ステータス	Published - 2003 6月 1

引用スタイル

@article{77738e07ad7d4fa281876443054ed728,

title = "Stress relaxation in dual-damascene Cu interconnects to suppress stress-induced voiding",

author = "M.Kawano M.Kawano and T.Fukase T.Fukase and Y.Yamamoto Y.Yamamoto and T.Ito T.Ito and S.Yokogawa S.Yokogawa and H.Tsuda H.Tsuda and Y.Kunimune Y.Kunimune and T.Saitoh T.Saitoh and K.Ueno K.Ueno and Kazuyoshi Ueno",

year = "2003",

month = jun,

day = "1",

language = "English",

pages = "210--212",

journal = "Proc. 2003 International Interconnect Technology conference",

}

TY - JOUR

T1 - Stress relaxation in dual-damascene Cu interconnects to suppress stress-induced voiding

AU - M.Kawano, M.Kawano

AU - T.Fukase, T.Fukase

AU - Y.Yamamoto, Y.Yamamoto

AU - T.Ito, T.Ito

AU - S.Yokogawa, S.Yokogawa

AU - H.Tsuda, H.Tsuda

AU - Y.Kunimune, Y.Kunimune

AU - T.Saitoh, T.Saitoh

AU - K.Ueno, K.Ueno

AU - Ueno, Kazuyoshi

PY - 2003/6/1

Y1 - 2003/6/1

M3 - Article

SP - 210

EP - 212

JO - Proc. 2003 International Interconnect Technology conference

JF - Proc. 2003 International Interconnect Technology conference

ER -