Study on low-cycle fatigue testing and therrmal fatigue life prediction of electroplated copper thin film for through hole via

Kazuki Watanabe; Naoyuki Yajima; Yoshiharu Kariya; Yoshiyuki Hiroshima; Shunichi Kikuchi; Akiko Matsui; Hiroshi Shimizu

doi:10.23919/LTB-3D.2017.7947481

Study on low-cycle fatigue testing and therrmal fatigue life prediction of electroplated copper thin film for through hole via

Kazuki Watanabe, Naoyuki Yajima, Yoshiharu Kariya, Yoshiyuki Hiroshima, Shunichi Kikuchi, Akiko Matsui, Hiroshi Shimizu

研究成果: Conference contribution

抄録

A new fatigue test method was proposed for low-cycle fatigue lives of electroplated copper for the through hole via (THV) in a printed wiring board. And the fatigue life of THV predicted from the Manson-Coffin's law of thermal fatigue test was good agreement with the thermal fatigue life obtained from the experimental result of thermal fatigue test of THV.

本文言語	English
ホスト出版物のタイトル	Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017
出版社	Institute of Electrical and Electronics Engineers Inc.
ページ	85
ページ数	1
ISBN（電子版）	9784904743034
DOI	https://doi.org/10.23919/LTB-3D.2017.7947481
出版ステータス	Published - 2017 6月 13
イベント	5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017 - Tokyo, Japan 継続期間: 2017 5月 16 → 2017 5月 18

出版物シリーズ

名前	Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017

Other

Other	5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017
国/地域	Japan
City	Tokyo
Period	17/5/16 → 17/5/18

ASJC Scopus subject areas

電子工学および電気工学
産業および生産工学
電子材料、光学材料、および磁性材料
表面、皮膜および薄膜

文献へのアクセス

10.23919/LTB-3D.2017.7947481

他のファイルとリンク

フィンガープリント

「Study on low-cycle fatigue testing and therrmal fatigue life prediction of electroplated copper thin film for through hole via」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル

Watanabe, K., Yajima, N., Kariya, Y., Hiroshima, Y., Kikuchi, S., Matsui, A., & Shimizu, H. (2017). Study on low-cycle fatigue testing and therrmal fatigue life prediction of electroplated copper thin film for through hole via. In Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017 (pp. 85). [7947481] (Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/LTB-3D.2017.7947481

Study on low-cycle fatigue testing and therrmal fatigue life prediction of electroplated copper thin film for through hole via. / Watanabe, Kazuki; Yajima, Naoyuki; Kariya, Yoshiharu その他.
Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc., 2017. p. 85 7947481 (Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017).

研究成果: Conference contribution

Watanabe, K, Yajima, N, Kariya, Y, Hiroshima, Y, Kikuchi, S, Matsui, A & Shimizu, H 2017, Study on low-cycle fatigue testing and therrmal fatigue life prediction of electroplated copper thin film for through hole via. in Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017., 7947481, Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017, Institute of Electrical and Electronics Engineers Inc., pp. 85, 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017, Tokyo, Japan, 17/5/16. https://doi.org/10.23919/LTB-3D.2017.7947481

Watanabe K, Yajima N, Kariya Y, Hiroshima Y, Kikuchi S, Matsui A その他. Study on low-cycle fatigue testing and therrmal fatigue life prediction of electroplated copper thin film for through hole via. In Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc. 2017. p. 85. 7947481. (Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017). doi: 10.23919/LTB-3D.2017.7947481

Watanabe, Kazuki ; Yajima, Naoyuki ; Kariya, Yoshiharu その他. / Study on low-cycle fatigue testing and therrmal fatigue life prediction of electroplated copper thin film for through hole via. Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc., 2017. pp. 85 (Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017).

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abstract = "A new fatigue test method was proposed for low-cycle fatigue lives of electroplated copper for the through hole via (THV) in a printed wiring board. And the fatigue life of THV predicted from the Manson-Coffin's law of thermal fatigue test was good agreement with the thermal fatigue life obtained from the experimental result of thermal fatigue test of THV.",

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