TY - JOUR
T1 - Synthetic criterion for level-1 crack-free package - proposal of a superior package structure
AU - Inoue, Yumi
AU - Sawada, Kanako
AU - Kawamura, Noriyasu
AU - Sudo, Toshio
PY - 1996/1/1
Y1 - 1996/1/1
N2 - A synthetic criterion to provide guidance for the high-reliability structure design for the level-1 crack-free package is introduced. The criterion reflects a consideration of both delamination and package cracking. According to the criterion, to prevent delamination is the most effective means to realize the level-1 crack-free package for large chips (ex. 15mm square). Therefore, a new package structure, a chip side support (CSS) structure which eliminates a die-pad is proposed and reliability tests are carried out. The CSS package realizes the level-1 crack-free package without moisture-proof packing.
AB - A synthetic criterion to provide guidance for the high-reliability structure design for the level-1 crack-free package is introduced. The criterion reflects a consideration of both delamination and package cracking. According to the criterion, to prevent delamination is the most effective means to realize the level-1 crack-free package for large chips (ex. 15mm square). Therefore, a new package structure, a chip side support (CSS) structure which eliminates a die-pad is proposed and reliability tests are carried out. The CSS package realizes the level-1 crack-free package without moisture-proof packing.
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M3 - Conference article
AN - SCOPUS:0029721490
SN - 0569-5503
SP - 71
EP - 77
JO - Proceedings - Electronic Components and Technology Conference
JF - Proceedings - Electronic Components and Technology Conference
T2 - Proceedings of the 1996 IEEE 46th Electronic Components & Technology Conference, ECTC
Y2 - 28 May 1996 through 31 May 1996
ER -