@inproceedings{88b6ec45e81d455faeb549652bfd0c44,
title = "Thermal fatigue life evaluation of CSP joints by mechanical fatigue testing",
abstract = "The interrelation between a thermal cycle test and a mechanical shear fatigue test has been studied for CSP joints from the view point of fatigue life and the microstructural damage of solder joints. The fatigue lives in both methods are almost equivalent even though loading method is different. From the viewpoint of microstructure, the fact is attributed to that the transgranular failure is predominant mode and a microstructural coarsening which is induced by thermal loading and stress equivalent for both the thermal cycle test and the mechanical shear fatigue test.",
keywords = "CSP, Mechanical fatigue test, Microstructure, Sn-Ag-Cu, Thermal cycle test",
author = "Yoshihiko Kanda and Kunihiro Zama and Yoshiharu Kariya and Hironori Oota and Shunichi Kikuchi and Hideki Yamabe and Kazuhiko Nakamura",
year = "2010",
doi = "10.1109/ITHERM.2010.5501291",
language = "English",
isbn = "9781424453429",
series = "2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010",
booktitle = "2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010",
note = "2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010 ; Conference date: 02-06-2010 Through 05-06-2010",
}