Thermal Fatigue Life of Eutectic Solder Bumps for Flip-chip Interconnection,

K.Doi K.Doi, N.Hirano N.Hirano, M.Mukai M.Mukai, T.Okada T.Okada, Y.Hiruta Y.Hiruta, T.Sudo T.Sudo, Toshio Sudo

研究成果: Article › 査読

本文言語	English
ページ（範囲）	103-104
ジャーナル	The 2nd VLSI Packaging Workshop,
出版ステータス	Published - 1993 12月 5

引用スタイル

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title = "Thermal Fatigue Life of Eutectic Solder Bumps for Flip-chip Interconnection,",

author = "K.Doi K.Doi and N.Hirano N.Hirano and M.Mukai M.Mukai and T.Okada T.Okada and Y.Hiruta Y.Hiruta and T.Sudo T.Sudo and Toshio Sudo",

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AU - K.Doi, K.Doi

AU - N.Hirano, N.Hirano

AU - M.Mukai, M.Mukai

AU - T.Okada, T.Okada

AU - Y.Hiruta, Y.Hiruta

AU - T.Sudo, T.Sudo

AU - Sudo, Toshio

PY - 1993/12/5

Y1 - 1993/12/5

M3 - Article

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EP - 104

JO - The 2nd VLSI Packaging Workshop,

JF - The 2nd VLSI Packaging Workshop,

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