TY - JOUR
T1 - Thermal stability of a Schottky diode fabricated with transfer-free deposition of multilayer graphene on n-GaN by solid-phase reactions
AU - Uddin, Md Sahab
AU - Ueno, Kazuyoshi
N1 - Publisher Copyright:
© 2017 The Japan Society of Applied Physics.
PY - 2017/7
Y1 - 2017/7
N2 - Multilayer graphene (MLG)/n-GaN Schottky diodes were fabricated by transfer-free deposition of MLG on n-GaN by solid-phase reactions with cobalt as a catalyst. The thermal stability of the diodes was determined from the current-voltage (I-V) characteristics after annealing the diodes in vacuum at 200-500 °C, at intervals of 100 °C. The diode characteristics evaluated using a thermionic emission model and Cheung's function using I-V data revealed that the Schottky barrier diode (SBD) fabricated with MLG as a Schottky contact on n-GaN showed better thermal stability than the conventional Ni/n-GaN SBD. The prevention of Au diffusion to n-GaN with MLG as a diffusion barrier layer and the unaffected interface reactions between n-GaN and MLG are possible reasons for the improved thermal stability, enabling potential application of this new diode in highpower and high-temperature operations.
AB - Multilayer graphene (MLG)/n-GaN Schottky diodes were fabricated by transfer-free deposition of MLG on n-GaN by solid-phase reactions with cobalt as a catalyst. The thermal stability of the diodes was determined from the current-voltage (I-V) characteristics after annealing the diodes in vacuum at 200-500 °C, at intervals of 100 °C. The diode characteristics evaluated using a thermionic emission model and Cheung's function using I-V data revealed that the Schottky barrier diode (SBD) fabricated with MLG as a Schottky contact on n-GaN showed better thermal stability than the conventional Ni/n-GaN SBD. The prevention of Au diffusion to n-GaN with MLG as a diffusion barrier layer and the unaffected interface reactions between n-GaN and MLG are possible reasons for the improved thermal stability, enabling potential application of this new diode in highpower and high-temperature operations.
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U2 - 10.7567/JJAP.56.07KD05
DO - 10.7567/JJAP.56.07KD05
M3 - Article
AN - SCOPUS:85026273637
SN - 0021-4922
VL - 56
JO - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes
JF - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes
IS - 7
M1 - 07KD05
ER -