TY - GEN
T1 - Three-dimensional micro modification and selective etching of crystalline silicon using 1.56-μm subpicosecond laser pulses
AU - Matsuo, Shigeki
AU - Oda, Keiji
AU - Naoi, Yoshiki
PY - 2013/10/18
Y1 - 2013/10/18
N2 - Three dimensional micro removal processing was attempted to crystalline silicon substrate using a 1.56-μm subpicosecond laser. Selective removal was observed on both top and rear surfaces when nitric hydrofluoric acid was used as etchant.
AB - Three dimensional micro removal processing was attempted to crystalline silicon substrate using a 1.56-μm subpicosecond laser. Selective removal was observed on both top and rear surfaces when nitric hydrofluoric acid was used as etchant.
UR - http://www.scopus.com/inward/record.url?scp=84885450721&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84885450721&partnerID=8YFLogxK
U2 - 10.1109/CLEOPR.2013.6600555
DO - 10.1109/CLEOPR.2013.6600555
M3 - Conference contribution
AN - SCOPUS:84885450721
SN - 9781467364751
T3 - Pacific Rim Conference on Lasers and Electro-Optics, CLEO - Technical Digest
BT - 2013 Conference on Lasers and Electro-Optics Pacific Rim, CLEO-PR 2013
T2 - 10th Conference on Lasers and Electro-Optics Pacific Rim, CLEO-PR 2013
Y2 - 30 June 2013 through 4 July 2013
ER -