Three-Dimensional Passive Circuit Technology For Ultra-Compact MMIC' s

Makoto Hirano, Kenjiro Nishikawa, Ichihiko Toyoda, Shinji Aoyama, Suehiro Sugitani, Kimiyoshi Yamasaki

研究成果: Article査読

53 被引用数 (Scopus)


A novel passive circuit technology of a three-dimensional (3-D) metal-insulator structure is developed for ultra-compact MMIC' s. By combining vertical passive elements, such as a wall-like microwire for shielding or coupling, and a pillar-like via connection with multilayer passive circuits, a 3-D passive circuit structure is formed to implement highly dense and more functional MMIC' s. O2/He RIE for forming trenches and holes in a thick plyimide insulator, low-current electroplating for foming gold metal sidewalls in the trenches or holes, and ion-milling with a WSiN stopper layer for patterning the gold metal are used to produce such a structure. The complete 3-D structure provides miniature microstrip lines effectively shielded with a vertical metal-wall, a miniature balun with low-loss vertical wall-like microwires, and inverted microstrip lines jointed with pillar-like vias through a thick polyimide layer. This technology stages next-generation ultra-compact MMIC's by producing various functional passive circuits in a very small area.

ジャーナルIEEE Transactions on Microwave Theory and Techniques
出版ステータスPublished - 1995 12月

ASJC Scopus subject areas

  • 放射線
  • 凝縮系物理学
  • 電子工学および電気工学


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