TY - JOUR
T1 - Three-dimensional passive circuit technology for ultra-compact MMICs
AU - Hirano, Makoto
AU - Nishikawa, Kenjiro
AU - Toyoda, Ichihiko
AU - Aoyama, Shinji
AU - Sugitani, Suehiro
AU - Yamasaki, Kimiyoshi
PY - 1995/1/1
Y1 - 1995/1/1
N2 - A novel passive circuit technology of a three-dimensional (3D) metal-insulator structure has been developed for ultra-compact MMICs. By combining vertical passive elements, such as a wall-like microwire for shielding or coupling and a pillar-like via connection, with multilayer passive circuits, highly dense and more functional MMICs can be implemented.
AB - A novel passive circuit technology of a three-dimensional (3D) metal-insulator structure has been developed for ultra-compact MMICs. By combining vertical passive elements, such as a wall-like microwire for shielding or coupling and a pillar-like via connection, with multilayer passive circuits, highly dense and more functional MMICs can be implemented.
UR - http://www.scopus.com/inward/record.url?scp=0029210125&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=0029210125&partnerID=8YFLogxK
M3 - Conference article
AN - SCOPUS:0029210125
SN - 0149-645X
VL - 3
SP - 1447
EP - 1450
JO - IEEE MTT-S International Microwave Symposium Digest
JF - IEEE MTT-S International Microwave Symposium Digest
T2 - Proceedings of the 1995 IEEE MTT-S International Microwave Symposium. Part 1 (of 3)
Y2 - 16 May 1995 through 20 May 1995
ER -