Novel three-dimensional structures for passive elements - inductors, capacitors, transmission lines, and air-bridges - have been developed to reduce the area they consume in GaAs MMICs. These structures can be formed with a simple technology by electroplating along the sidewalls of a photoresist. Adopting the new structures, most passive elements in MMICs have been shrunk to less than 1/4 the size of conventional ones.
|ジャーナル||IEICE Transactions on Electronics|
|出版ステータス||Published - 1993 6月 1|
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