Three-dimensional passive elements for compact GaAs MMICs

Makoto Hirano; Yuhki Imai; Ichihiko Toyoda; Kenjiro Nishikawa; Masami Tokumitsu; Kazuyoshi Asai

Three-dimensional passive elements for compact GaAs MMICs

Makoto Hirano, Yuhki Imai, Ichihiko Toyoda, Kenjiro Nishikawa, Masami Tokumitsu, Kazuyoshi Asai

研究成果: Article › 査読

抄録

Novel three-dimensional structures for passive elements - inductors, capacitors, transmission lines, and air-bridges - have been developed to reduce the area they consume in GaAs MMICs. These structures can be formed with a simple technology by electroplating along the sidewalls of a photoresist. Adopting the new structures, most passive elements in MMICs have been shrunk to less than 1/4 the size of conventional ones.

本文言語	English
ページ（範囲）	961-967
ページ数	7
ジャーナル	IEICE Transactions on Electronics
巻	E76-C
号	6
出版ステータス	Published - 1993 6月 1

ASJC Scopus subject areas

電子材料、光学材料、および磁性材料
電子工学および電気工学

他のファイルとリンク

引用スタイル

@article{03bc6b094a41476a9a32bde2b685fc7c,

title = "Three-dimensional passive elements for compact GaAs MMICs",

abstract = "Novel three-dimensional structures for passive elements - inductors, capacitors, transmission lines, and air-bridges - have been developed to reduce the area they consume in GaAs MMICs. These structures can be formed with a simple technology by electroplating along the sidewalls of a photoresist. Adopting the new structures, most passive elements in MMICs have been shrunk to less than 1/4 the size of conventional ones.",

author = "Makoto Hirano and Yuhki Imai and Ichihiko Toyoda and Kenjiro Nishikawa and Masami Tokumitsu and Kazuyoshi Asai",

year = "1993",

month = jun,

day = "1",

language = "English",

volume = "E76-C",

pages = "961--967",

journal = "IEICE Transactions on Electronics",

issn = "0916-8524",

publisher = "Maruzen Co., Ltd/Maruzen Kabushikikaisha",

number = "6",

}

TY - JOUR

T1 - Three-dimensional passive elements for compact GaAs MMICs

AU - Hirano, Makoto

AU - Imai, Yuhki

AU - Toyoda, Ichihiko

AU - Nishikawa, Kenjiro

AU - Tokumitsu, Masami

AU - Asai, Kazuyoshi

PY - 1993/6/1

Y1 - 1993/6/1

N2 - Novel three-dimensional structures for passive elements - inductors, capacitors, transmission lines, and air-bridges - have been developed to reduce the area they consume in GaAs MMICs. These structures can be formed with a simple technology by electroplating along the sidewalls of a photoresist. Adopting the new structures, most passive elements in MMICs have been shrunk to less than 1/4 the size of conventional ones.

AB - Novel three-dimensional structures for passive elements - inductors, capacitors, transmission lines, and air-bridges - have been developed to reduce the area they consume in GaAs MMICs. These structures can be formed with a simple technology by electroplating along the sidewalls of a photoresist. Adopting the new structures, most passive elements in MMICs have been shrunk to less than 1/4 the size of conventional ones.

UR - http://www.scopus.com/inward/record.url?scp=0027611720&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0027611720&partnerID=8YFLogxK

M3 - Article

AN - SCOPUS:0027611720

SN - 0916-8524

VL - E76-C

SP - 961

EP - 967

JO - IEICE Transactions on Electronics

JF - IEICE Transactions on Electronics

IS - 6

ER -

Three-dimensional passive elements for compact GaAs MMICs

抄録

ASJC Scopus subject areas

他のファイルとリンク

フィンガープリント

引用スタイル