TY - GEN
T1 - Three-dimensional routing for multilayer ceramic printed circuit boards
AU - Hanafusa, Akihiko
AU - Yamashita, Yasuhiro
AU - Yasuda, Mitsuru
PY - 1990/12/1
Y1 - 1990/12/1
N2 - An efficient three-dimensional (3-D) routing technique is presented for multilayer ceramic printed circuit (PC) boards. The router can take account of via length as well as pattern length. In the first of the two steps involved, it searches in the direction of via depth from start and end points only. This is called two-and-a-half-dimension (2.5-D) routing. Step two combines 2-D and 3-D routing for wiring not covered in step one. This enables tens of thousands of wires to be routed at 99% effectiveness in less than four hours of CPU time, with all delay conditions satisfied.
AB - An efficient three-dimensional (3-D) routing technique is presented for multilayer ceramic printed circuit (PC) boards. The router can take account of via length as well as pattern length. In the first of the two steps involved, it searches in the direction of via depth from start and end points only. This is called two-and-a-half-dimension (2.5-D) routing. Step two combines 2-D and 3-D routing for wiring not covered in step one. This enables tens of thousands of wires to be routed at 99% effectiveness in less than four hours of CPU time, with all delay conditions satisfied.
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M3 - Conference contribution
AN - SCOPUS:0025531311
SN - 0818620552
T3 - 1990 IEEE International Conference on Computer-Aided Design. Digest of Technical Papers
SP - 386
EP - 389
BT - 1990 IEEE International Conference on Computer-Aided Design. Digest of Technical Papers
PB - Publ by IEEE
T2 - 1990 IEEE International Conference on Computer-Aided Design - ICCAD-90
Y2 - 11 November 1990 through 15 November 1990
ER -