TY - JOUR
T1 - Tin pest in lead-free solders
AU - Kariya, Yoshiharu
AU - Gagg, Colin
AU - Plumbridge, William J.
PY - 2001
Y1 - 2001
N2 - The low temperature effect on the characteristics of lead-free alloys based on tin (Sn) were analyzed. The allotropic transformation of white tin into grey tin at temperatures below 286 K were studied. The effects of prolonged exposure of Sn-0.5 copper alloy and Sn-37 lead alloy to low temperatures were also studied. The results showed that tin pest at low temperatures lead to the disintegration of real joints.
AB - The low temperature effect on the characteristics of lead-free alloys based on tin (Sn) were analyzed. The allotropic transformation of white tin into grey tin at temperatures below 286 K were studied. The effects of prolonged exposure of Sn-0.5 copper alloy and Sn-37 lead alloy to low temperatures were also studied. The results showed that tin pest at low temperatures lead to the disintegration of real joints.
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U2 - 10.1108/09540910110361730
DO - 10.1108/09540910110361730
M3 - Article
AN - SCOPUS:0035112052
SN - 0954-0911
VL - 13
SP - 39
EP - 40
JO - Soldering and Surface Mount Technology
JF - Soldering and Surface Mount Technology
IS - 1
ER -