Uniform (111) textured Cu CVD on vacuum annealed Cu seed layer

K. Ueno; A. Sekiguchi; A. Kobayashi

doi:10.1109/IITC.1998.704768

Uniform (111) textured Cu CVD on vacuum annealed Cu seed layer

K. Ueno, A. Sekiguchi, A. Kobayashi

研究成果: Conference contribution

1 被引用数 (Scopus)

抄録

The vacuum anneal effects of the Cu seed on Cu CVD have been investigated. The vacuum anneal removes the surface oxide of the air-exposed Cu seed and enhances the (111) texture of the seed. The incubation period which has been observed with the air-exposed Cu seed has been eliminated by the vacuum anneal and better film morphology and improved sheet resistance uniformity has been obtained. Epitaxial CVD has been observed on the vacuum annealed seed and led to the enhanced (111) texture.

本文言語	English
ホスト出版物のタイトル	Proceedings of the IEEE 1998 International Interconnect Technology Conference, IITC 1998
出版社	Institute of Electrical and Electronics Engineers Inc.
ページ	119-121
ページ数	3
ISBN（電子版）	0780342852, 9780780342859
DOI	https://doi.org/10.1109/IITC.1998.704768
出版ステータス	Published - 1998
外部発表	はい
イベント	1998 IEEE International Interconnect Technology Conference, IITC 1998 - San Firancisco, United States 継続期間: 1998 6月 1 → 1998 6月 3

出版物シリーズ

名前	Proceedings of the IEEE 1998 International Interconnect Technology Conference, IITC 1998
巻	1998-June

Other

Other	1998 IEEE International Interconnect Technology Conference, IITC 1998
国/地域	United States
City	San Firancisco
Period	98/6/1 → 98/6/3

ASJC Scopus subject areas

ハードウェアとアーキテクチャ
電子工学および電気工学

文献へのアクセス

10.1109/IITC.1998.704768

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引用スタイル

Ueno, K., Sekiguchi, A., & Kobayashi, A. (1998). Uniform (111) textured Cu CVD on vacuum annealed Cu seed layer. In Proceedings of the IEEE 1998 International Interconnect Technology Conference, IITC 1998 (pp. 119-121). (Proceedings of the IEEE 1998 International Interconnect Technology Conference, IITC 1998; Vol. 1998-June). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IITC.1998.704768

Uniform (111) textured Cu CVD on vacuum annealed Cu seed layer. / Ueno, K.; Sekiguchi, A.; Kobayashi, A.
Proceedings of the IEEE 1998 International Interconnect Technology Conference, IITC 1998. Institute of Electrical and Electronics Engineers Inc., 1998. p. 119-121 (Proceedings of the IEEE 1998 International Interconnect Technology Conference, IITC 1998; Vol. 1998-June).

研究成果: Conference contribution

Ueno, K, Sekiguchi, A & Kobayashi, A 1998, Uniform (111) textured Cu CVD on vacuum annealed Cu seed layer. in Proceedings of the IEEE 1998 International Interconnect Technology Conference, IITC 1998. Proceedings of the IEEE 1998 International Interconnect Technology Conference, IITC 1998, vol. 1998-June, Institute of Electrical and Electronics Engineers Inc., pp. 119-121, 1998 IEEE International Interconnect Technology Conference, IITC 1998, San Firancisco, United States, 98/6/1. https://doi.org/10.1109/IITC.1998.704768

Ueno K, Sekiguchi A, Kobayashi A. Uniform (111) textured Cu CVD on vacuum annealed Cu seed layer. In Proceedings of the IEEE 1998 International Interconnect Technology Conference, IITC 1998. Institute of Electrical and Electronics Engineers Inc. 1998. p. 119-121. (Proceedings of the IEEE 1998 International Interconnect Technology Conference, IITC 1998). doi: 10.1109/IITC.1998.704768

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Uniform (111) textured Cu CVD on vacuum annealed Cu seed layer

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