TY - GEN
T1 - Visco-elastic effect of underfill material in reliability analysis of flip-chip package
AU - Kanda, Yoshihiko
AU - Zama, Kunihiro
AU - Kariya, Yoshiharu
AU - Mikami, Takao
AU - Kobayashi, Takaya
AU - Sato, Toshiyuki
AU - Enomoto, Toshiaki
AU - Hirata, Koichi
PY - 2010/6/25
Y1 - 2010/6/25
N2 - The effect of viscoelasticity of underfill on the reliability analysis of flip-chip package by using FEA has been investigated in this study. The analytical result on thermal warpage of a package is different depending on whether the underfill is assumed to be elastic or viscoelastic. The difference is prominent in materials with low Tg, specifically during the cooling process. The viscoelastic effect of the underfill on the fatigue life of the solder bumps is also appears in materials with low Tg, and the predicted fatigue life of a package is about twice as short if the underfill is assumed to be elastic instead of viscoelastic. Thus, the differences in the assumption regarding the viscoelastic properties of the underfill affect the reliability analysis of the packages under thermal cycling condition using FEA.
AB - The effect of viscoelasticity of underfill on the reliability analysis of flip-chip package by using FEA has been investigated in this study. The analytical result on thermal warpage of a package is different depending on whether the underfill is assumed to be elastic or viscoelastic. The difference is prominent in materials with low Tg, specifically during the cooling process. The viscoelastic effect of the underfill on the fatigue life of the solder bumps is also appears in materials with low Tg, and the predicted fatigue life of a package is about twice as short if the underfill is assumed to be elastic instead of viscoelastic. Thus, the differences in the assumption regarding the viscoelastic properties of the underfill affect the reliability analysis of the packages under thermal cycling condition using FEA.
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U2 - 10.1115/InterPACK2009-89152
DO - 10.1115/InterPACK2009-89152
M3 - Conference contribution
AN - SCOPUS:77953742803
SN - 9780791843598
T3 - Proceedings of the ASME InterPack Conference 2009, IPACK2009
SP - 755
EP - 759
BT - Proceedings of the ASME InterPack Conference 2009, IPACK2009
T2 - 2009 ASME InterPack Conference, IPACK2009
Y2 - 19 July 2009 through 23 July 2009
ER -