Wideband and High-Isolation Properties by the Combination of Thin-Film Embedded Capacitor and Planer EBG Structure

Toshio Sudo, Seiju Ichijo, Takanobu Kushihira

研究成果: Article › 査読

本文言語	English
ページ（範囲）	1212-1217
ジャーナル	IEEE 57th Electronic Components and Technology Conference
出版ステータス	Published - 2007 5月 31

引用スタイル

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title = "Wideband and High-Isolation Properties by the Combination of Thin-Film Embedded Capacitor and Planer EBG Structure",

author = "Toshio Sudo and Seiju Ichijo and Takanobu Kushihira",

year = "2007",

month = may,

day = "31",

language = "English",

pages = "1212--1217",

journal = "IEEE 57th Electronic Components and Technology Conference",

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T1 - Wideband and High-Isolation Properties by the Combination of Thin-Film Embedded Capacitor and Planer EBG Structure

AU - Sudo, Toshio

AU - Ichijo, Seiju

AU - Kushihira, Takanobu

PY - 2007/5/31

Y1 - 2007/5/31

M3 - Article

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EP - 1217

JO - IEEE 57th Electronic Components and Technology Conference

JF - IEEE 57th Electronic Components and Technology Conference

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