WLAN/WPAN

研究成果: Editorial › 査読

本文言語	English
論文番号	4523203
ページ（範囲）	354
ページ数	1
ジャーナル	Digest of Technical Papers - IEEE International Solid-State Circuits Conference
巻	51
DOI	https://doi.org/10.1109/ISSCC.2008.4523203
出版ステータス	Published - 2008
外部発表	はい
イベント	2008 IEEE International Solid State Circuits Conference, ISSCC - San Francisco, CA, United States 継続期間: 2008 2月 3 → 2008 2月 7

ASJC Scopus subject areas

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title = "WLAN/WPAN",

author = "Arya Behzad and Tadashi Maeda",

year = "2008",

doi = "10.1109/ISSCC.2008.4523203",

language = "English",

volume = "51",

pages = "354",

journal = "Digest of Technical Papers - IEEE International Solid-State Circuits Conference",

issn = "0193-6530",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

note = "2008 IEEE International Solid State Circuits Conference, ISSCC ; Conference date: 03-02-2008 Through 07-02-2008",

}

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AU - Behzad, Arya

AU - Maeda, Tadashi

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SP - 354

JO - Digest of Technical Papers - IEEE International Solid-State Circuits Conference

JF - Digest of Technical Papers - IEEE International Solid-State Circuits Conference

M1 - 4523203

T2 - 2008 IEEE International Solid State Circuits Conference, ISSCC

Y2 - 3 February 2008 through 7 February 2008

ER -